Sieving range : 5 μm – 850 μm Sieve Diameter : 76 mm Sieving motion : Sonic energy pulsing Fraction 수 : 1 ~ 6 Speed : 3,600 pulses / min at 50/60 Hz Time : 0 ~ 99.9 min size : w 254 x d 254 x h 508 mm Weight : 16.8 kg Power : Different voltages available